Nanostructured and Interconnect Materials Lab
About
Nilesh Badwe, Assistant Professor
- Specialization: Mechanical properties of materials, Microelectronics packaging
- Areas of Interest: Nanoporous metals, Electrodeposition of nanocrystalline alloys, Interconnect materials
- Email: nbadwe@iitk.ac.in
- Office: Faculty Building 412 B
- Phone: +91 512 259 2205
- CV: (Click here)

Education
Doctor of Philosophy
2014
Arizona State University, USA
Bachelor of Technology
2008
Metallurgical Engineering and Materials Science, IIT Bombay
Award
- TMG Excellence Award, Intel Corporation (2018)
- ATTD and CQN Department Recognition Awards, Intel Corporation (2017, 2019, 2019, 2021, 2021)
- University Graduate Fellowship - Arizona State University (2008, 2012)
- Among top 3 students (out of 560) selected from IIT Bombay for Tata steel scholarship (2007 - 08)
- Among top 3 students from Maharashtra selected for Hinduja merit cum means scholarship (2001 - 08)
Professional Experience
Assistant Professor
Feb 2021 - Present
Materials Science and Engineering, IIT Kanpur
Staff Packaging R&D Engineer & Materials Technologist
Mar 2020 - Feb 2021
Intel Corporation
Packaging R&D Engineer
Jul 2015 - Mar 2020
Intel Corporation
Post-Doctoral Research Scholar
Dec 2014 - Jul 2015
Arizona State University (ASU)
Research
Our research focuses on the development of novel metals and alloys for advanced applications. We aim is to identify the failure mechanisms for different materials under the use conditions through structure-property correlation. This knowledge is then used to improve the performance through material design viz. alloy development, microstructure engineering, coatings, etc. while ensuring a viable manufacturing process.
Nanoporous Metals
- Typically synthesized through the dissolution of a less noble metal from a binary alloy
- Possesses extremely high specific surface area
- Research focus: Fracture mechanisms in nanoporous metals
- Applications in actuation, catalysis, biosensing, and super-capacitors

Strain field measured through DIC and high-speed camera 4.34µs/frame
Nanocrystalline alloys
- High strength owing to small grain size
- Research focus: Thermally stable, high conductivity, and fatigue resistant nanocrystalline alloy development through electrodeposition
- Anti Hume-Rothery rules to develop binary immiscible alloy systems with the alloying element(s) segregating at the grain boundaries to provide grain stability
- Applications in infrastructure as coatings and MEMS devices
Interconnect materials
- Inherent part of electronic devices; critical properties include conductivity, electromigration, thermal fatigue, and high strain rate fracture
- Research Focus: High reliability manufacturing friendly interconnect alloy development including Sn-Bi based low temperature solders, Ag sintering, Cu-Cu bonding etc.
- Applications in electronic devices
Electrodeposited Porous Materials for Advanced Thermal Management
- Research focus: Development and optimization of electrodeposited porous copper through DHBT electrodeposition for tunable porosity, enhanced capillary wicking, surface wettability, efficient heat dissipation, and mechanical reliability.
- Application in Immersion cooling systems for high-power electronics, EV batteries.
Teaching
Spring 2025
- MSE684: MSE684: Introduction to Semiconductor Packaging (Instructor)
Fall 2024
- MSE351: Mechanical and Electronic Properties of Materials Laboratory (Instructor)
Spring 2024
- MSE684: Introduction to Advanced Microelectronics Packaging (Instructor)
- MSE353A: Instrumentation for Materials Engineering Laboratory (Instructor)
Fall 2023
- MSE313A: Mechanical Behaviour Laboratory (Instructor)
Spring 2023
- TA201A: Manufacturing Processes I (Instructor & Tutor)
Fall 2022
- MSE658A: Dislocations and Plasticity (Instructor)
Spring 2022
- MSE684A: Introduction to Advanced Microelectronics Packaging (Instructor)
Fall 2021
- MSE658A: Dislocations and Plasticity (Instructor)
- TA201A: Manufacturing Processes I (Tutor)
Summer 2021
- TA201A: Manufacturing Processes I (Tutor)
Team
Ph.D. Students
![]() Gulnaz Parween |
![]() Ankush Kumar
|
![]() Alka Jangid
|
Alumni
Dr. Chiranjit PoddarPost Doctoral Fellow |
![]() Akshay Kumar PrasadM.Tech. Student |
![]() Swastika PaulM.Tech. Student |
![]() Sriram RadhakrishnanM.Tech. Student |
![]() Ramjan MallickM.Tech. Student |
Rohan VermaBT-MT Student |
![]() Arko BasakB.Tech. Student |
Ravleen KaurB.Tech. (SURGE) Student |
Ashutosh JaiswalB.Tech. (SURGE) Student |
Deepanshu RathiB.Tech. (SURGE) Student |
Harsh Kumar SinghB.Tech. (SURGE) Student |
Facilities
Potentiostat/Galvanostat
(GAMRY Interference 1010B)
Source Measure Unit
(KEITHLEY 2461EC)
Source Measure Unit
(KEYSIGHT B2902B)
Tube Furnace
(Max Temp 1100°C)
Tensile Tester (DEBEN MT5000DL)
Load cells: 1kN and 5kN
Displacement rates: 0.03 – 1 mm/min
Temperature: Room temp – 525C (Jaw heating)
Polishing Machine
Facilities as part of MacDermid Alpha Thermal Reliability Lab
Optical Microscope
( OLYMPUS DSX1000)
Oven
(Max Temp 250 °C )
Thermal Shock Chamber
(ESPEC TSA-73EL-A)
Contact
Location:
Faculty Building (FB) 412 B, Department of Materials Science & Engineering, IIT Kanpur, UP - 208016, INDIA
Lab:
Nanostructured and Interconnect Materials Laboratory, Western Labs 214, Department of Materials Science & Engineering, IIT Kanpur, UP - 208016, INDIA
E.mail:
nbadwe@iitk.ac.in
Phone:
+91 512 259 2205










