Nanostructured and Interconnect Materials Lab

About

Nilesh Badwe, Assistant Professor

  • Specialization: Mechanical properties of materials, Microelectronics packaging
  • Areas of Interest: Nanoporous metals, Electrodeposition of nanocrystalline alloys, Interconnect materials
  • Email: nbadwe@iitk.ac.in
  • Office: Faculty Building 412 B
  • Phone: +91 512 259 2205
  • CV: (Click here)

Education

Doctor of Philosophy

2014

Arizona State University, USA

Bachelor of Technology

2008

Metallurgical Engineering and Materials Science, IIT Bombay

Award

  • TMG Excellence Award, Intel Corporation (2018)
  • ATTD and CQN Department Recognition Awards, Intel Corporation (2017, 2019, 2019, 2021, 2021)
  • University Graduate Fellowship - Arizona State University (2008, 2012)
  • Among top 3 students (out of 560) selected from IIT Bombay for Tata steel scholarship (2007 - 08)
  • Among top 3 students from Maharashtra selected for Hinduja merit cum means scholarship (2001 - 08)

Professional Experience

Assistant Professor

Feb 2021 - Present

Materials Science and Engineering, IIT Kanpur

Staff Packaging R&D Engineer & Materials Technologist

Mar 2020 - Feb 2021

Intel Corporation

Packaging R&D Engineer

Jul 2015 - Mar 2020

Intel Corporation

Post-Doctoral Research Scholar

Dec 2014 - Jul 2015

Arizona State University (ASU)

Research

Our research focuses on the development of novel metals and alloys for advanced applications. We aim is to identify the failure mechanisms for different materials under the use conditions through structure-property correlation. This knowledge is then used to improve the performance through material design viz. alloy development, microstructure engineering, coatings, etc. while ensuring a viable manufacturing process.



Nanoporous Metals


  • Typically synthesized through the dissolution of a less noble metal from a binary alloy
    • Possesses extremely high specific surface area
  • Research focus: Fracture mechanisms in nanoporous metals
    • Applications in actuation, catalysis, biosensing, and super-capacitors


Strain field measured through DIC and high-speed camera 4.34µs/frame



Nanocrystalline alloys


  • High strength owing to small grain size
  • Research focus: Thermally stable, high conductivity, and fatigue resistant nanocrystalline alloy development through electrodeposition
    • Anti Hume-Rothery rules to develop binary immiscible alloy systems with the alloying element(s) segregating at the grain boundaries to provide grain stability
    • Applications in infrastructure as coatings and MEMS devices


Interconnect materials


  • Inherent part of electronic devices; critical properties include conductivity, electromigration, thermal fatigue, and high strain rate fracture
  • Research Focus: High reliability manufacturing friendly interconnect alloy development including Sn-Bi based low temperature solders, Ag sintering, Cu-Cu bonding etc.
    • Applications in electronic devices


Electrodeposited Porous Materials for Advanced Thermal Management


  • Research focus: Development and optimization of electrodeposited porous copper through DHBT electrodeposition for tunable porosity, enhanced capillary wicking, surface wettability, efficient heat dissipation, and mechanical reliability.
  • Application in Immersion cooling systems for high-power electronics, EV batteries.

Teaching

Spring 2025

  • MSE684: MSE684: Introduction to Semiconductor Packaging (Instructor)

Fall 2024

  • MSE351: Mechanical and Electronic Properties of Materials Laboratory (Instructor)

Spring 2024

  • MSE684: Introduction to Advanced Microelectronics Packaging (Instructor)
  • MSE353A: Instrumentation for Materials Engineering Laboratory (Instructor)

Fall 2023

  • MSE313A: Mechanical Behaviour Laboratory (Instructor)

Spring 2023

  • TA201A: Manufacturing Processes I (Instructor & Tutor)

Fall 2022

  • MSE658A: Dislocations and Plasticity (Instructor)

Spring 2022

Fall 2021

  • MSE658A: Dislocations and Plasticity (Instructor)
  • TA201A: Manufacturing Processes I (Tutor)

Summer 2021

  • TA201A: Manufacturing Processes I (Tutor)

Team


Ph.D. Students



Gulnaz Parween

linkedin Profile
 
 


Ankush Kumar
(Co-supervisor:
Prof. Chih Chen, NYCU, Taiwan)

linkedin Profile


Alka Jangid
(Co-supervisor:
Prof. Sudhanshu Shekhar Singh)

linkedin Profile


BT-MT Dual Degree/M.Tech. Student



Waqar Mallik

linkedin Profile


Sandeep Nishad

linkedin Profile


Alumni


Dr. Chiranjit Poddar

Post Doctoral Fellow
linkedin Profile


Akshay Kumar Prasad

M.Tech. Student
linkedin Profile


Swastika Paul

M.Tech. Student
linkedin Profile


Sriram Radhakrishnan

M.Tech. Student
linkedin Profile


Ramjan Mallick

M.Tech. Student
linkedin Profile

Rohan Verma

BT-MT Student
linkedin Profile


Arko Basak

B.Tech. Student
linkedin Profile

Ravleen Kaur

B.Tech. (SURGE) Student
linkedin Profile

Ashutosh Jaiswal

B.Tech. (SURGE) Student
linkedin Profile

Deepanshu Rathi

B.Tech. (SURGE) Student
linkedin Profile

Harsh Kumar Singh

B.Tech. (SURGE) Student
linkedin Profile

Facilities


Potentiostat/Galvanostat
(GAMRY Interference 1010B)


Source Measure Unit
(KEITHLEY 2461EC)


Source Measure Unit
(KEYSIGHT B2902B)


Tube Furnace
(Max Temp 1100°C)


Tensile Tester (DEBEN MT5000DL)
Load cells: 1kN and 5kN Displacement rates: 0.03 – 1 mm/min Temperature: Room temp – 525C (Jaw heating)


Polishing Machine


Facilities as part of MacDermid Alpha Thermal Reliability Lab



Optical Microscope
( OLYMPUS DSX1000)


Oven
(Max Temp 250 °C )


Thermal Shock Chamber
(ESPEC TSA-73EL-A)

Contact

Location:

Faculty Building (FB) 412 B, Department of Materials Science & Engineering, IIT Kanpur, UP - 208016, INDIA

Lab:

Nanostructured and Interconnect Materials Laboratory, Western Labs 214, Department of Materials Science & Engineering, IIT Kanpur, UP - 208016, INDIA

E.mail:

nbadwe@iitk.ac.in

Phone:

+91 512 259 2205